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Obsolete Device
37LV36/65/128
36K, 64K, and 128K Serial EPROM Family
FEATURES
* * * * * * * * * * * * * * * Operationally equivalent to Xilinx XC1700 family Wide voltage range 3.0 V to 6.0 V Maximum read current 10 mA at 5.0 V Standby current 100 A typical Industry standard Synchronous Serial Interface/ 1 bit per rising edge of clock Full Static Operation Sequential Read/Program Cascadable Output Enable 10 MHz Maximum Clock Rate @ 5.0 Vdc Programmable Polarity on Hardware Reset Programming with industry standard EPROM programmers Electrostatic discharge protection > 4,000 volts 8-pin PDIP/SOIC and 20-pin PLCC packages Data Retention > 200 years Temperature ranges: - Commercial: 0C to +70C - Industrial: -40C to +85C
PACKAGE TYPES
PDIP
DATA CLK RESET/OE CE 1 8 VCC VPP CEO VSS
37LV36 37LV65 37LV128
2 3 4
7 6 5
SOIC
DATA CLK RESET/OE CE 1 8 VCC VPP CEO VSS
37LV36 37LV65 37LV128
2 3 4
7 6 5
PLCC
DATA VCC
20 12 19 18 17 VPP 16 15 14 CEO 13 3 2 10 1 11
DESCRIPTION
The Microchip Technology Inc. 37LV36/65/128 is a family of Serial OTP EPROM devices organized internally in a x32 configuration. The family also features a cascadable option for increased memory storage where needed. The 37LV36/65/128 is suitable for many applications in which look-up table information storage is desirable and provides full static operation in the 3.0V to 6.0V VCC range. The devices also support the industry standard serial interface to the popular RAM-based Field Programmable Gate Arrays (FPGA). Advanced CMOS technology makes this an ideal bootstrap solution for today's high speed SRAM-based FPGAs. The 37LV36/65/128 family is available in the standard 8-pin plastic DIP, 8-pin SOIC and 20-pin PLCC packages. Device 37LV36 37LV65 37LV128 Bits 36,288 65,536 131,072 Programming Word 1134 x 32 2048 x 32 4096 x 32
CLK 4
5
37LV36 37LV65 37LV128
9
RESET/OE 6
7
CE 8
Vss
BLOCK DIAGRAM
Xilinx is a registered trademark of Xilinx Corporation.
2004 Microchip Technology Inc.
DS21109F-page 1
37LV36/65/128
1.0
1.1
ELECTRICAL CHARACTERISTICS
Maximum Ratings*
TABLE 1-1:
Name DATA CLK
PIN FUNCTION TABLE
Function Data I/O Clock Input 8 1 2 3 4 5 6 7 8 20 2 4 6 8 10 14 17 20
VCC and input voltages w.r.t. VSS .......... -0.6V to +0.6V VPP voltage w.r.t. VSS during programming ...................................... -0.6V to +14.0V Output voltage w.r.t. VSS ................-0.6V to VCC +0.6V Storage temperature ..........................-65C to +150C Ambient temp. with power applied .....-65C to +125C Soldering temperature of leads (10 sec.) ......... +300C ESD protection on all pins ..................................... 4 kV
*Notice: Stresses above those listed under "Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability.
RESET/OE Reset Input and Output Enable CE VSS CEO VPP VCC Chip Enable Input Ground Chip Enable Output Programming Voltage Supply +3.0V to 6.0V Power Supply
Not Labeled Not utilized, not connected
TABLE 1-2:
READ OPERATION DC CHARACTERISTICS
VCC = +3.0 to 6.0V Commercial (C): Tamb = 0C to +70C Industrial (I): Tamb = -40C to +85C
Parameter DATA, CE, CEO and Reset pins: High level input voltage Low level input voltage High level output voltage Low level output voltage Input Leakage Output Leakage Input Capacitance (all inputs/outputs) Operating Current
Symbol VIH VIL VOH1 VOH2 VOL ILI ILO CINT ICC Read
Min. 2.0 -0.3 3.86 2.4 -- -10 -10 -- -- -- --
Max. VCC 0.8
Units V V V V A A pF mA mA A A
Conditions
.32 10 10 10 10 2 100 50
IOH = -4 mA VCC 4.5V IOH = -4 mA VCC 3.0V IOL = 4.0 mA VIN = .1V to VCC VOUT = .1V to VCC Tamb = 25C; FCLK = 1 MHz (Note 1) VCC = 6.0V, CLK = 10 MHz VCC = 3.6V, CLK = 2.5 MHz Outputs open VCC = 6.0V, CE = 5.8V VCC = 3.6V, CE = 3.4V
Standby Current
ICCS
Note 1: This parameter is initially characterized and not 100% tested.
DS21109F-page 2
2004 Microchip Technology Inc.
37LV36/65/128
2.0
2.1
DATA
Data I/O
8.0
CASCADING SERIAL EPROMS
Three-state DATA output for reading and input during programming.
Cascading Serial EPROMs provide additional memory for multiple FPGAs configured as a daisy-chain, or for future applications requiring larger configuration memories. When the last bit from the first Serial EPROM is read, the next clock signal to the Serial EPROM asserts its CEO output LOW and disables its DATA line. The second Serial EPROM recognizes the LOW level on its CE input and enables its DATA output. When configuration is complete, the address counters of all cascaded Serial EPROMs are reset if RESET goes LOW forcing the RESET/OE on each Serial EPROM to go HIGH. If the address counters are not to be reset upon completion, then the RESET/OE inputs can be tied to ground. Additional logic may be required if cascaded memories are so large that the rippled chip enable is not fast enough to activate successive Serial EPROMs.
3.0
3.1
CLK
Clock Input
Used to increment the internal address and bit counters for reading and programming.
4.0
4.1
RESET/OE
Reset Input and Output Enable
A LOW level on both the CE and RESET/OE inputs enables the data output driver. A HIGH level on RESET/OE resets both the address and bit counters. In the 37LVXXX, the logic polarity of this input is programmable as either RESET/OE or OE/RESET. This document describes the pin as RESET/OE although the opposite polarity is also possible. This option is defined and set at device program time.
9.0
STANDBY MODE
5.0
5.1
CE
Chip Enable Input
The 37LVXXX enters a low-power Standby Mode whenever CE is HIGH. In Standby Mode, the Serial EPROM consumes less than 100 A of current. The output will remain in a high-impedance state regardless of the state of the OE input.
CE is used for device selection. A LOW level on both CE and OE enables the data output driver. A HIGH level on CE disables both the address and bit counters and forces the device into a low power mode.
10.0
PROGRAMMING MODE
6.0
6.1
CEO
Chip Enable Output
Programming Mode is entered by holding VPP HIGH (+13 volts) for two clock edges and then holding VPP = VDD for one clock edge. Programming mode is exited by driving a LOW on both CE and OE and then removing power from the device. Figures 4 through 7 show the programming algorithm.
This signal is asserted LOW on the clock cycle following the last bit read from the memory. It will stay LOW as long as CE and OE are both LOW. It will then follow CE until OE goes HIGH. Thereafter, CEO will stay HIGH until the entire EPROM is read again. This pin also used to sense the status of RESET polarity when Programming Mode is entered.
11.0
37LVXXX RESET POLARITY
The 37LVXXX lets the user choose the reset polarity as either RESET/OE or OE/RESET. Any third-party commercial programmer should prompt the user for the desired reset polarity. The programming of the overflow word should be handled transparently by the EPROM programmer; it is mentioned here as supplemental information only. The polarity is programmed into the first overflow word location, maximum address+1. 00000000 in these locations makes the reset active LOW, FFFFFFFF in these locations makes the reset active HIGH. The default condition is RESET active HIGH.
7.0
7.1
VPP
Programming Voltage Supply
Used to enter programming mode (+13 volts) and to program the memory (+13 volts). Must be connected directly to Vcc for normal Read operation. No overshoot above +14 volts is permitted.
2004 Microchip Technology Inc.
DS21109F-page 3
37LV36/65/128
FIGURE 11-1: READ CHARACTERISTICS TIMING
TABLE 11-1:
READ CHARACTERISTICS
AC Testing Waveform: VIL = 0.2V; VIH = 3.0V AC Test Load: 50 pF VOL = VOL_MAX; VOH = VOH_MIN Limits 3.0V Vcc 6.0V Min. Max. 45 60 200 -- 50 -- -- -- -- -- -- Limits 4.5V Vcc 6.0V Min. -- -- -- 0 -- 25 25 25 80 0 0 20 2.5 -- Max. 45 50 60 -- 50 -- -- -- -- -- -- -- 10 ns ns ns ns ns ns ns ns ns ns ns ns MHz Note 1 Note 1 Notes 1, 2
Symbol
Parameter
Units
Conditions
TOE TCE TCAC TOH TDF TLC THC TSCE TSCED THCE THCED THOE CLK max
OE to Data Delay CE to Data Delay CLK to Data Delay Data Hold from CE, OE or CLK CE or OE to Data Float Delay CLK Low Time CLK High Time CE Set up Time to CLK (to guarantee proper counting) CE setup time to CLK (to guarantee proper DATA read) CE Hold Time to CLK (to guarantee proper counting) CE hold time to CLK (to guarantee proper DATA read) OE High Time (Guarantees counters are Reset) Clock Frequency
-- -- -- 0 -- 100 100 40 100 0 50 100 --
Note 1: This parameter is periodically sampled and not 100% tested. 2: Float delays are measured with output pulled through 1k to VLOAD = VCC/2.
DS21109F-page 4
2004 Microchip Technology Inc.
37LV36/65/128
FIGURE 11-2: READ CHARACTERISTICS AT END OF ARRAY TIMING
TABLE 11-2:
READ CHARACTERISTICS AT END OF ARRAY
AC Testing Waveform: VIL = 0.2V; VIH = 3.0V AC Test Load: 50 pF VOL = VOL_MAX; VOH = VOH_MIN Limits 3.0V Vcc Limits 4.5V Vcc 6.0V 6.0V Min. Max. 50 65 45 45 Min. -- -- -- -- Max. 50 40 40 40 ns ns ns ns Notes 1, 2
Symbol
Parameter
Units
Conditions
TCDF TOCK TOCE TOOE
CLK to Data Float Delay CLK to CEO Delay CE to CEO Delay RESET/OE to CEO Delay
-- -- -- --
Note 1: This parameter is periodically sampled and not 100% tested. 2: Float delays are measured with output pulled through 1k to VLOAD = VCC/2.
2004 Microchip Technology Inc.
DS21109F-page 5
37LV36/65/128
TABLE 11-3:
DIP/SOIC Pin 1 2 3
PIN ASSIGNMENTS IN THE PROGRAMMING MODE
PLCC Pin 2 4 6 Name DATA CLK RESET/OE I/O I/O I I Description The rising edge of the clock shifts a data word in or out of the EPROM one bit at a time. Clock Input. Used to increment the internal address/word counter for reading and programming operation. The rising edge of CLK shifts a data word into the EPROM when CE and OE are HIGH; it shifts a data word out of the EPROM when CE is LOW and OE is HIGH. The address/ word counter is incremented on the rising edge of CLK while CE is held HIGH and OE is held LOW. Note 1: Any modified polarity of the RESET/OE pin is ignored in the programming mode.
4
8
CE
I
The rising edge of CLK shifts a data word into the EPROM when CE and OE are HIGH; it shifts a data word out of the EPROM when CE is LOW and OE is HIGH. The address/ word counter is incremented on the rising edge of CLK while CE is held HIGH and OE is held LOW. Ground pin.
5 6
10 14
VSS CEO O
The polarity of the RESET/OE pin can be read by sensing the CEO pin. Note 1: The polarity of the RESET/OE pin is ignored while in the Programming Mode. In final verification, this pin must be monitored to go LOW one clock cycle after the last data bit has been read.
7
17
VPP
Programming Voltage Supply. Programming Mode is entered by holding CE and OE HIGH and VPP at VPP1 for two rising clock edges and then lowering VPP to VPP2 for one more rising clock edge. A word is programmed by strobing the device with VPP for the duration TPGM. VPP must be tied to VCC for normal read operation. +5 V power supply input.
8
20
VCC
DS21109F-page 6
2004 Microchip Technology Inc.
37LV36/65/128
TABLE 11-4: DC PROGRAMMING SPECIFICATIONS
Ambient Temperature: Tamb = 25C 5C Min. VCCP VIL VIH VOL VOH VPP1 VPP2 IPPP IL VCCL VCCH Supply voltage during programming Low-level input voltage High-level input voltage Low-level output voltage High-level output voltage Programming voltage* Programming Mode access voltage Supply current in Programming Mode Input or output leakage current First pass Low-level supply voltage for final verification Second pass High-level supply voltage for final verification 5.0 0.0 2.4 -- 3.7 12.5 VCCP -- -10 2.8 6.4 Limits Units Max. 6.0 0.5 VCC 0.4 -- 13.5 VCCP+1 100 10 3.0 6.6 V V V V V V V mA A V V
Symbol
Parameter
* No overshoot is permitted on this signal. VPP must not be allowed to exceed 14 volts.
TABLE 11-5:
AC PROGRAMMING SPECIFICATIONS (SEE NOTE 2)
Limits
Symbol TRPP TFPP TPGM TSVC TSVCE TSVOE THVC TSDP THDP TLCE TSCC TSIC THIC THOV TPCAC TPOH TPCE
Parameter Min. 10% to 90% Rise Time of VPP 90% to 10% Fall Time of VPP VPP Programming Pulse Width VPP Setup to CLK for Entering Programming Mode CE Setup to CLK for Entering Programming Mode OE Setup to CLK for Entering Programming Mode VPP Hold from CLK for Entering Programming Mode Data Setup to CLK for Programming Data Hold from CLK for Programming CE Low time to clear data latches CE Setup to CLK for Programming/Verifying OE Setup to CLK for Incrementing Address Counter OE Hold from CLK for Incrementing Address Counter OE Hold from VPP CLK to Data Valid Data Hold from CLK CE Low to Data Valid 0 250 1 1 .50 100 100 100 300 50 0 100 100 100 0 200 400 1.05 Max.
Units s s ms ns ns ns ns ns ns ns ns ns ns ns ns ns ns
Conditions Note 1 Note 1
Note 1 Note 1 Note 1 Note 1
Note 1
Note 1: This parameter is periodically sampled and not 100% tested. Note 2: While in Programming Mode, CE should only be changed while OE is HIGH and has been HIGH for 200 ns, and OE should only be changed while CE is HIGH and has been HIGH for 200 ns.
2004 Microchip Technology Inc.
DS21109F-page 7
37LV36/65/128
FIGURE 11-3: ENTER AND EXIT PROGRAMMING MODES
Enter Mode
VCC VPP VPP2 TRPP TSVC THVC CLK TSVC TFPP VCCP VPP1
Exit Mode
DATA TSVCE CE TSVOE RESET/OE
FIGURE 11-4: PROGRAMMING CYCLE OVERVIEW (NO VERIFY UNTIL ENTIRE ARRAY IS PROGRAMMED)
VCC = VCCP VCC VPP1 VPP = VPP2 Enter 500 s Programming Programming Mode Mode
VPP
500 s Programming Mode
500 s Programming Mode
500 s Programming Mode
CLK 2 CLKS **Load Word 1
CE low to clear data latches
**Load Word 2
**Load Word 3
**Load Word 4
**Load Word 5
Clock Increments Address Counter
CE
RESET/OE High if RESET/OE configured *
CEO
*
*
*
*
** 32 Clocks *Note: The CEO pin is high impedance when VPP = VPP1
Low if RESET/OE configured
FIGURE 11-5: DETAILS OF PROGRAM CYCLE
DS21109F-page 8
2004 Microchip Technology Inc.
37LV36/65/128
FIGURE 11-6: READ MANUFACTURER AND DEVICE ID OVERVIEW
FIGURE 11-7: DETAILS OF READ MANUFACTURER AND DEVICE ID
2004 Microchip Technology Inc.
DS21109F-page 9
37LV36/65/128
FIGURE 11-8: 37LVXXX PROGRAMMING SPECIFICATIONS
Start
Check Device ID
Device Power Off Device Power On
Enter Programming Mode 1. 2. 3. VCC = VCCP VPP = VPP2 CE = OE = VIH VPP = VPP1 for 2 CLK Rising Edges VPP = VPP2 for 1 CLK Rising Edge
32 bit data word to be programmed = FFFFFFFFhex
Yes
No CE low to clear EPROM internal data latches
Load 32-bit word to be programmed
Increment Address Counter
Pulse VPP to VPP1 (13V) for Tpgm (500 s)
No
Last Word? Yes Exit Programming Mode Device Power Off Device Power On
Yes 1st Pass? No Device Failure
Fail
Verify All Data Bits (Read Mode) VCC = VPP = VCCL and VCC = VPP = VCCH
Pass Device Passed
DS21109F-page 10
2004 Microchip Technology Inc.
37LV36/65/128
37LV36/65/128 Product Identification System
To order or to obtain information, e.g., on pricing or delivery, please use the listed part numbers, and refer to the factory or the listed sales offices.
37LV36/65/128
-
IT
/P Package: Temperature Range: Shipping: P = Plastic DIP, 8 lead SN = Plastic SOIC (150 mil Body), 8 lead L = Plastic Leaded Chip Carrier (PLCC), 20 lead Blank = 0C to +70C I = -40C to +85C Blank = Tube T = Tape and Reel 37LV128 37LV65 37LV36 128K Serial EPROM 64K Serial EPROM 36K Serial EPROM
Device:
2004 Microchip Technology Inc.
DS21109F-page 11
37LV36/65/128
NOTES:
DS21109F-page 12
2004 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices: * * Microchip products meet the specification contained in their particular Microchip Data Sheet. Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. Microchip is willing to work with the customer who is concerned about the integrity of their code. Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as "unbreakable."
*
* *
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip's code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device applications and the like is intended through suggestion only and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. No representation or warranty is given and no liability is assumed by Microchip Technology Incorporated with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. Use of Microchip's products as critical components in life support systems is not authorized except with express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any intellectual property rights.
Trademarks The Microchip name and logo, the Microchip logo, Accuron, dsPIC, KEELOQ, microID, MPLAB, PIC, PICmicro, PICSTART, PRO MATE, PowerSmart, rfPIC, and SmartShunt are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. AmpLab, FilterLab, MXDEV, MXLAB, PICMASTER, SEEVAL, SmartSensor and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, dsPICDEM, dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM, PICkit, PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal, PowerInfo, PowerMate, PowerTool, rfLAB, rfPICDEM, Select Mode, Smart Serial, SmartTel and Total Endurance are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. (c) 2004, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper.
Microchip received ISO/TS-16949:2002 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona and Mountain View, California in October 2003. The Company's quality system processes and procedures are for its PICmicro(R) 8-bit MCUs, KEELOQ(R) code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip's quality system for the design and manufacture of development systems is ISO 9001:2000 certified.
2004 Microchip Technology Inc.
DS21109F-page 13
WORLDWIDE SALES AND SERVICE
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07/12/04
2004 Microchip Technology Inc.

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